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onsemi Launches MOSFETs With Innovative Top-Cool Packaging

Top-side cooling simplifies design and reduces cost for compact power solutions.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

onsemi announced a series of new MOSFET devices that feature innovative top-side cooling to assist designers in challenging automotive applications, especially within motor control and DC/DC conversion. The company showed the new devices at electronica, the world’s leading trade fair and conference for electronics.

Housed in a TCPAK57 package measuring just 5mm x 7mm, the new Top Cool devices feature a 16.5mm2 thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (PCB).

By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density. Improved reliability of the new design adds to an overall extended system lifetime.

“Cooling is one of the greatest challenges in high power design and successfully addressing it is the key enabler to reducing size and weight, which is critical in modern automotive design,” said Fabio Necco, VP and GM, Automotive Power Solutions at onsemi. “With excellent electrical efficiency and having eliminated the PCB from the thermal path, the design is significantly simplified while reducing size and cost.”

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